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Intel has unveiled the architecture of microprocessors which 14nm fabrication process which will allow more circuits on the chip than its previous generation of processors. It uses second-generation Tri-gate (FinFET) transistors with industry-leading performance, power, density and cost per transistor. This technology will be used to manufacture high-performance to low-power products including servers and personal computing devices.
The Core M chip code-named ‘Broadwell’. Because of its small size, PCs mayn’t require cooling fans. “The combination of the new microarchitecture and manufacturing process will usher in a wave of innovation in new form factors, experiences and systems that are thinner and run silent and cool. Intel architects and chip designers have achieved greater than two times reduction in the thermal design point when compared to a previous generation of processor while providing similar performance and improved battery life.”, the company said in a statement.